Heng Tian Mei 60/40 Low Melt Tin Lead Rosin Core Solder Wire for Electronic Soldering (0.8mm/50g)

WARNING: This product can expose you to chemicals including Lead which is known to the State of California to cause cancer and birth defects or other reproductive harm. Remind to wash your hands after using it.

HTM 60/40 Solder Wire

Features: - Built-in rosin core - Good fluidity - Low melting point (361°F/183°C) - Solder joints are fuller and stronger without impurities - Good use experience

Specifications: Brand: HengTianMei Tin to Lead Content Ratio: Tin 60% - Lead 40% (Sn60-Pb40) Melting Point: 361°F/183°C Diameter: 0.8 mm/0.031 inch/20 gauge Solder wire flux content: 1.8% Weight: 50g/1.76oz

What is the use of rosin cores? This solder wire contains a rosin core, which helps improve its fluidity and use effect. When soldering, the tin drops can quickly stick to the circuit board, and the solder joint will be very full.

The rosin core acts as a flux, with a lower melting point than the solder material. Its lower weight, viscosity, and surface tension allow it to melt first and quickly cover the solder surface, playing a role in isolating the air to prevent oxidation of the metal surface.

The rosin can also react with the solder and the surface oxide film of the metal being soldered under the high temperature of welding, melting and restoring the pure metal surface.

Scope of Use: The reasonable alloy content ratio and the addition of rosin flux make the solder joints firm, with a full color and luster. The excellent fluidity makes it easier to operate, making it suitable for soldering various electronic components and manual DIY operations.

Service and Support: We have a professional service team, ready to provide the best service for each customer. We look forward to the start of our cooperation, and if you have any questions, please feel free to contact us.

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